CS4121
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Lead Count
16L PDIP*
20L SOIC*
Metric
Max
Min
19.69 18.67
13.00 12.60
English
Max Min
.775 .735
.512 .496
Thermal Data
R
QJC
typ
R
QJA
typ
16L PDIP*
15
50
20L SOIC*
9
55
ûC/W
ûC/W
*Internally
Fused Leads
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
8.26 (.325)
7.62 (.300)
3.68 (.145)
2.92 (.115)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
REF: JEDEC MS-001
D
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
1.27 (.050)
0.40 (.016)
REF: JEDEC MS-013
0.32 (.013)
0.23 (.009)
D
0.30 (.012)
0.10 (.004)
Ordering Information
Part Number
CS4121ENF16
CS4121EDWF20
CS4121EDWFR20
Description
16L PDIP
(internally fused leads)
20L SOIC
(internally fused leads)
20L SOIC
(internally fused leads)
(tape & reel)
8
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
© 1999 Cherry Semiconductor Corporation
Rev. 12/4/96
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
