FM120 THRU FM1200
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5
o
C ~40
o
C Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
Critical Zone
TL to TP
TL
Tsmax
TL
Tsmin
Temperature
tS
Preheat
Ramp-down
25
t25 C to Peak
o
Time
3.Reflow soldering
Profile Feature
Average ramp-up rate(T
L
to T
P
)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t
s
)
Tsmax to T
L
-Ramp-upRate
Time maintained above:
-Temperature(T
L
)
-Time(t
L
)
Peak Temperature(T
P
)
Time within 5
o
C of actual Peak
Temperature(t
P
)
Ramp-down Rate
Time 25
o
C to Peak Temperature
Soldering Condition
o
<3 C /sec
150
o
C
200
o
C
60~120sec
<3
o
C/sec
217
o
C
60~260sec
255
o
C-0/+5
o
C
10~30sec
<6
o
C/sec
<6minutes
MDD ELECTRONIC
CHENDA [ Chendahang Electronics Co., Ltd ]
