BZT52C2V4S-BZT52C39S
ZENER DIODE
SOD-323
1.35(0.053)
1.15(0.045)
1.26(.050)
1.24(.048)
FEATURES
Planar die construction
Ultra-Small surface mount package
Ideally suited for automated assembly processes
1.80(0.071)
1.60(0.063)
2.75(0.108)
2.30(0.091)
1.80(0.071)
1.60(0.063)
2.75(0.108)
2.30(0.091)
MECHANICAL DATA
0.4(0.016)
.25(0.010)
.177(.007)
.089(.003)
1.00(.040)
0.80(.031)
0.1(0.004)
MIN
.305(0.012)
.295(0.010)
.72(0.028)
.69(0.027)
Case:
Molded plastic body
Terminals:
Plated leads solderable per MIL-STD-750,
Method 2026
Polarity:
Polarity symbols marked on case
.08(.003)
MIN
Dimensions in millimeters and (inches)
Maximum ratings (Tamb=25C unless otherwise specified)
PARAMETER
Forward voltage (Note 2)
@I
F
=10mA
Power dissipation (Note1)
Thermal resistance, Junction to ambient air (Note1)
Operating and storage temperature range
SYMBOLS
Limits
0.9
200
625
-65 to +150
UNITS
V
mW
C/W
C
V
F
P
d
R
ΘJA
T
J
,T
STG
NOTES: 1.Valid provided that device terminals are kept at ambient temperature.
2.Short duration test pulse used in minimize self-heating effect.
3.f=1KHz.
MDD ELECTRONIC