UPC3223TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to V
CC
line.
(4) The inductor must be attached between V
CC
and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 C or higher
Preheating time at 120 to 180 C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Partial Heating
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260 C or below
: 10 seconds or less
: 60 seconds or less
: 120 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350 C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
WS260
Condition Symbol
IR260
For soldering
Preheating temperature (package surface temperature) : 120 C or below
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10491EJ01V0DS
13
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