CAT4134
PACKAGE INFORMATION
Thin DFN 12-Pad 3mm x 3mm, 0.45mm Pitch
TDFN 12-Lead 3 x 3mm, 0.45mm Pitch
PIN 1 ID
L
PIN 1 INDENT
C
e
D
E2
5 x e
b
A1
D2
E
A
LAND PATTERN
0.95
SYMBOL
MIN
0.70
0.00
0.18
NOM
0.75
MAX
0.80
0.05
0.30
A
A1
b
0.02
0.45
0.23
C
0.20 REF
3.00
D
2.90
1.60
2.90
2.30
3.10
1.80
3.10
2.50
D2
E
1.70
2.40
3.00
E2
e
2.40
0.45
L
0.35
0.45
0.55
0.23
1.70
3.00
4.00
Legend:
Package
Land Pattern
Notes:
1. All dimensions in millimeters. Angles in degrees.
2. Coplanarity shall not exceed 0.08mm.
3. Warpage shall not exceed 0.10mm.
4. Package length / package width are considered as special characteristic.
5. Refer JEDEC MO-229.
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
© 2006 Catalyst Semiconductor, Inc.
Characteristics subject to change without notice.
11
Doc. No. 5021 Rev. A
CATALYST [ CATALYST SEMICONDUCTOR ]
