PRELIMINARY
CM3065
Mechanical Details
The CM3065 is available in either an 8-lead SOIC or a
3-lead TO-263 package.
SOIC-8 Mechanical Specifications
Dimensions for CM3065 devices supplied in an 8-lead
SOIC package are presented below.
For complete information on the SOIC-8 package, see
the California Micro Devices SOIC Package Informa-
tion document.
H
Pin 1
Marking
8
Mechanical Package Diagrams
TOP VIEW
D
7
6
5
E
PACKAGE DIMENSIONS
Package
Leads
Dimensions
A
A
1
B
C
D
E
e
H
L
# per tube
# per tape
and reel
Millimeters
Min
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.40
Max
1.75
0.25
0.51
0.25
5.00
4.19
6.20
1.27
Min
0.053
0.004
0.013
0.007
0.189
0.150
0.228
0.016
SOIC
8
Inches
Max
0.069
0.010
0.020
0.010
0.197
0.165
END VIEW
SEATING
PLANE
SIDE VIEW
1
2
3
4
A
B
e
A
1
1.27 BSC
0.050 BSC
0.244
0.050
L
C
100 pieces*
2500 pieces
Controlling dimension: inches
Package Dimensions for SOIC-8
* This is an approximate number which may vary.
©
2004 California Micro Devices Corp. All rights reserved.
08/16/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
5
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
