PRELIMINARY
CM3004
Mechanical Details
SOIC-8 Mechanical Specifications
Dimensions for the CM3004 supplied in an 8-lead
SOIC package are presented below.
For complete information on the SOIC-8 package, see
the California Micro Devices SOIC Package Informa-
tion document.
Mechanical Package Diagrams
TOP VIEW
D
8
7
6
5
PACKAGE DIMENSIONS
Package
Lead
Dimensions
A
A
1
B
C
D
E
e
H
L
# per tube
# per tape
and reel
Millimeters
Min
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.40
Max
1.75
0.25
0.51
0.25
5.00
4.19
6.20
1.27
Min
0.053
0.004
0.013
0.007
0.189
0.150
0.228
0.016
SOIC
8
Inches
Max
0.069
0.010
0.020
0.010
0.197
0.165
0.244
0.050
C
END VIEW
SEATING
PLANE
SIDE VIEW
1
2
3
4
H
Pin 1
Marking
E
A
B
e
A
1
1.27 BSC
0.050 BSC
100 pieces*
2500 pieces
Controlling dimension: inches
L
* This is an approximate number which may vary.
Package Dimensions for SOIC-8
©
2005 California Micro Devices Corp. All rights reserved.
01/10/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
9
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
