CM3003
Mechanical Details
SOIC-8 Mechanical Specifications
Mechanical Package Diagrams
Dimensions for CM3003 devices packaged in 8-pin
SOIC packages are presented below.
TOP VIEW
For complete information on the SOIC-8 package, see
the California Micro Devices SOIC Package Informa-
tion document.
D
8
7
6
5
PACKAGE DIMENSIONS
E
H
Pin 1
Marking
Package
Pins
SOIC
8
Millimeters
Inches
Dimensions
1
2
3
4
Min
Max
1.75
0.25
Min
Max
0.069
0.010
A
1.35
0.10
0.053
0.004
A
1
SIDE VIEW
B
0.33
0.19
4.80
3.80
0.51
0.25
5.00
4.19
0.013
0.007
0.189
0.150
0.020
0.010
0.197
0.165
C
A
D
SEATING
PLANE
A1
B
E
e
e
1.27 BSC
0.050 BSC
H
L
5.80
0.40
6.20
1.27
0.228
0.016
0.244
0.050
END VIEW
# per tube
100 pieces*
2500 pieces
C
# per tape
and reel
Controlling dimension: inches
L
* This is an approximate number which may vary.
Package Dimensions for SOIC-8
© 2004 California Micro Devices Corp. All rights reserved.
01/15/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214 L Fax: 408.263.7846
L
www.calmicro.com
11
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
