PRELIMINARY
CM2400-02/03/04
Mechanical Details (cont’d)
TSSOP-16 Mechanical Specifications
Mechanical Package Diagrams
Dimensions for the CM2400-02TS and CM2400-03TS
devices packages are presented below.
For complete information on the TSSOP-16 package,
see the California Micro Devices TSSOP Package
Information document.
TOP VIEW
D
16 15 14 13 12 11 10
9
PACKAGE DIMENSIONS
E
Package
Pins
TSSOP
16
H
Pin 1 Marking
Millimeters
Min Max
Inches
Max
Dimensions
Min
—
1
2
3
4
5
6
7
8
A
—
1.10
0.15
0.30
0.20
5.10
4.50
0.0433
0.006
A1
0.05
0.19
0.09
4.90
4.30
0.002
0.0075
0.0035
0.193
0.169
B
0.0118
0.0079
0.201
SIDE VIEW
C
D
A
A1
SEATING
PLANE
E
0.177
B
e
e
0.65 BSC
0.0256 BSC
H
L
6.25
0.50
6.50
0.70
0.246
0.020
0.256
0.028
END VIEW
# per tube
Consult Factory
2500 pcs
# per tape
and reel
C
Controlling dimension: millimeters
L
Dimensions for the TSSOP-16 Package
© 2004 California Micro Devices Corp. All rights reserved.
14 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
08/24/04
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
