PRELIMINARY
CM2400-02/03/04
Mechanical Details
The CM2400-02/03/04 family is available in a 16-lead
HBCC and 16-lead TSSOP packages.The mechanical
details for these packages are presented below.
Mechanical Package Diagrams
HBCC-16 Mechanical Specifications
TOP VIEW
Dimensions for the CM2400-02HB, CM2400-03HB and
CM2400-04HB devices packaged in 16-pin HBCC
packages are presented below.
A
D
13
9
A1
PACKAGE DIMENSIONS
E
Package
Pins
HBCC-16
16
Millimeters
Min Max
Inches
Max
Dimensions
Min
1
5
A
-
0.80
0.10
0.0315
0.0039
SIDE VIEW
A1
0.05
b1
b2
b3
0.25
0.30
0.30
0.35
0.40
0.40
0.0138
0.0157
0.0157
BOTTOM VIEW
D
2.90
1.45
3.10
1.55
0.1220
0.0610
e1
Dh
e
Dh
E
2.90
1.75
3.10
1.85
0.1220
0.0728
13
9
Eh
e
0.50 TYP.
0.0197 TYP.
e
e4
Eh
e2
e1
2.50 TYP.
2.50 TYP.
2.45 TYP.
2.45 TYP
0.0984 TYP.
0.0984 TYP.
0.0965 TYP.
0.0965 TYP.
e2
e3
1/2 e4
5
1
16
e4
Detail C
Detail B
1/2 e3
Detail A
# per tube
120 pieces*
2500 pieces
e3
# per tape
and reel
Controlling dimension: millimeters
CONTACT (PIN) DIMENSIONS
* This is an approximate number which may vary.
CF#0.20x45ο
b
b
b
3
2
1
b
b
b
2
3
1
Detail A
Detail B
Detail C
Dimensions for HBCC-16 Package
© 2004 California Micro Devices Corp. All rights reserved.
08/24/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com 13