CM2009
Mechanical Details
QSOP Mechanical Specifications
CM2009 devices are packaged in 16-pin QSOP pack-
ages. Dimensions are presented below.
For complete information on the QSOP-16 package,
see the California Micro Devices QSOP Package Infor-
mation document.
Mechanical Package Diagrams
TOP VIEW
D
16
15
14
13 12
11 10
9
PACKAGE DIMENSIONS
Package
Pins
Dimensions
A
A1
B
C
D
E
e
H
L
# per tube
# per tape
and reel
Millimeters
Min
1.35
0.10
0.20
0.18
4.80
3.81
5.79
0.40
Max
1.75
0.25
0.30
0.25
5.00
3.98
6.19
1.27
Min
0.053
0.004
0.008
0.007
0.189
0.150
0.228
0.016
QSOP (JEDEC name is SSOP)
16
Inches
Max
0.069
0.010
0.012
0.010
0.197
0.157
0.244
0.050
C
END VIEW
SIDE VIEW
1
2
3
4
5
6
7
8
H
Pin 1 Marking
E
A
SEATING
PLANE
A1
B
e
0.64 BSC
0.025 BSC
100 pcs*
2500 pcs
Controlling dimension: inches
L
* This is an approximate number which may vary.
Package Dimensions for QSOP-16
©
2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
08/12/04
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
