CM2009
Specifications (cont’d)
ELECTRICAL OPERATING CHARACTERISTICS
(SEE NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
V
CC_VIDEO
= 5.0V; VIDEO inputs at V
CC_VIDEO
or GND
V
CC_DDC
= 5.0V
V
CC_SYNC
= 5V; SYNC inputs at GND or V
CC_SYNC
;
SYNC outputs unloaded
V
CC_SYNC
= 5V; SYNC inputs at 3.0V;
SYNC outputs unloaded
V
F
V
IH
V
IL
V
OH
V
OL
R
OUT
R
OUT
R
OUT
V
OH-02
V
OL-02
I
IN
ESD Diode Forward Voltage
Logic High Input Voltage
Logic Low Input Voltage
Logic High Output Voltage
Logic Low Output Voltage
SYNC Driver Output Resistance
(CM2009-00 only)
SYNC Driver Output Resistance
(CM2009-01 only)
SYNC Driver Output Resistance
(CM2009-02 only)
Logic High Output Voltage
(CM2009-02 only)
Input Current
VIDEO Inputs
SYNC_IN1, SYNC_IN2 Inputs
I
OFF
V
ON
C
IN_VID
t
PLH
t
PHL
t
R,
t
F
V
ESD
Level Shifting N-MOSFET "OFF" State
Leakage Current
Voltage Drop Across Level-shifting
N-MOSFET when "ON"
VIDEO Input Capacitance
SYNC Driver L => H Propagation Delay
SYNC Driver H => L Propagation Delay
SYNC Driver Output Rise & Fall Times
ESD Withstand Voltage
I
F
= 10mA
V
CC_SYNC
= 5.0V; Note 2
V
CC_SYNC
= 5.0V; Note 2
I
OH
= 0mA, V
CC_SYNC
= 5.0V; Note 2
I
OL
= 0mA, V
CC_SYNC
= 5.0V; Note 2
V
CC_SYNC
= 5.0V; SYNC Inputs at GND or 3.0V
V
CC_SYNC
= 5.0V; SYNC Inputs at GND or 3.0V
V
CC_SYNC
= 5.0V; SYNC Inputs at GND or 3.0V;
Note 5
I
OH
= 24mA; V
CC_SYNC
= 5.0V; Note 2
2.0
0.8
±1
±1
10
10
0.18
4
4.5
12
12
4
±8
65
55
15
4.85
0.15
2.0
0.6
MIN
TYP
MAX UNITS
10
10
50
2.0
1.0
µA
µA
µA
mA
V
V
V
V
V
Ω
Ω
Ω
V
V
µA
µA
µA
µA
V
pF
pF
ns
ns
ns
kV
I
CC_VIDEO
V
CC_VIDEO
Supply Current
I
CC_DDC
I
CC_SYNC
V
CC_DDC
Supply Current
V
CC_SYNC
Supply Current
Logic Low Output Voltage (CM2009-02 only) I
OL
= 24mA; V
CC_SYNC
= 5.0V; Note 2
V
CC_VIDEO
= 5.0V; V
IN
= V
CC_VIDEO
or GND
V
CC_SYNC
= 5.0V; V
IN
= V
CC_SYNC
or GND
(V
CC_DDC
- V
DDC_IN
)
≤
0.4V; V
DDC_OUT
= V
CC_DDC
(V
CC_DDC
- V
DDC_OUT
)
≤
0.4V; V
DDC_IN
= V
CC_DDC
V
CC_DDC
= 2.5V; V
S
= GND; I
DS
= 3mA;
V
CC_VIDEO
= 5.0V; V
IN
= 2.5V;
ƒ
= 1MHz; Note 4
V
CC_VIDEO
= 2.5V; V
IN
= 1.25V;
ƒ
= 1MHz; Note 4
C
L
= 50pF; V
CC
= 5.0V; Input t
R
and t
F
≤
5ns
C
L
= 50pF; V
CC
= 5.0V; Input t
R
and t
F
≤
5ns
C
L
= 50pF; V
CC
= 5.0V; Input t
R
and t
F
≤
5ns
V
CC_VIDEO
= V
CC_SYNC
= 5V; Notes 3, 4 & 5
Note 1: All parameters specified over standard operating conditions unless otherwise noted.
Note 2: These parameters apply only to the SYNC drivers. Note that R
OUT
= R
T
+ R
BUFFER
.
Note 3: Per the IEC-61000-4-2 International ESD Standard, Level 4 contact discharge method. BYP, V
CC_VIDEO
and V
CC_SYNC
must
be bypassed to GND via a low impedance ground plane with a 0.2µF, low inductance, chip ceramic capacitor at each supply
pin. ESD pulse is applied between the applicable pins and GND. ESD pulses can be positive or negative with respect to
GND. Applicable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_OUT1, SYNC_OUT2, DDC_OUT1 and DDC_OUT2. All
other pins are ESD protected to the industry standard
±2kV
Human Body Model (MIL-STD-883, Method 3015). The bypass
capacitor at the BYP pin may optionally be omitted, in which case the max. ESD withstand voltage for the DDC_OUT1 and
DDC_OUT2 pins is reduced to
±4kV.
Note 4: This parameter is guaranteed by design and characterization.
Note 5: The SYNC_OUT pins on the CM2009-02 are guaranteed for 2kV HBM ESD protection.
©
2004 California Micro Devices Corp. All rights reserved.
4
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▲
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www.calmicro.com
08/12/04
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
