PRELIMINARY
CM2006
Specifications
ELECTRICAL OPERATING CHARACTERISTICS
(SEE NOTE 1)
SYMBOL
I
CC_DDC
I
CC
PARAMETER
V
CC_DDC
Supply Current
V
CC
Supply Current
CONDITIONS
V
CC_DDC
= 5.0V
V
CC
= 5V; SYNC inputs at GND or V
CC
;
SYNC outputs unloaded
V
CC
= 5V; SYNC inputs at 3.0V;
SYNC outputs unloaded
V
F
V
IH
V
IL
V
HYS
V
OH
V
OL
R
OUT
I
IN
ESD Diode Forward Voltage
Logic High Input Voltage
Logic Low Input Voltage
Hysteresis Voltage
Logic High Output Voltage
Logic Low Output Voltage
SYNC Driver Output Resistance
Input Current
VIDEO Inputs
SYNC_IN1, SYNC_IN2 Inputs
I
OFF
Level Shifting N-MOSFET "OFF" State
Leakage Current
I
F
= 10mA
V
CC
= 5.0V; Note 2
V
CC
= 5.0V; Note 2
V
CC
= 5.0V; Note 2
I
OH
= 0mA, V
CC
= 5.0V; Note 2
I
OL
= 0mA, V
CC
= 5.0V; Note 2
V
CC
= 5.0V; SYNC Inputs at GND or 3.0V
V
CC
= 5.0V; V
IN
= V
CC
or GND
V
CC
= 5.0V; V
IN
= V
CC
or GND
(V
CC_DDC
- V
DDC_IN
)
<
0.4V; V
DDC_OUT
= V
CC_DDC
(V
CC_DDC
- V
DDC_OUT
)
<
0.4V; V
DDC_IN
= V
CC_DDC
10
0.18
3
3.5
12
12
3
±
2
±
8
7
15
4.0
0.15
24
±10
±10
10
10
400
2.0
0.5
MIN
TYP
MAX UNITS
10
1
2.0
1.0
μA
mA
mA
V
V
V
mV
V
V
Ω
μA
μA
μA
μA
μA
V
pF
pF
ns
ns
ns
kV
kV
I
BACKDRIVE
Current conducted from input pins when Vcc V
CC
< V
INPUT_PIN ;
Note 6
is powered down.
V
ON
C
IN_VID
t
PLH
t
PHL
t
R,
t
F
V
ESD1
V
ESD
Voltage Drop Across Level-shifting
N-MOSFET when "ON"
VIDEO Input Capacitance
SYNC Driver L => H Propagation Delay
SYNC Driver H => L Propagation Delay
SYNC Driver Output Rise & Fall Times
ESD Withstand Voltage, Sync_out pins only
ESD Withstand Voltage
V
CC_DDC
= 2.5V; V
S
= GND; I
DS
= 3mA;
V
CC
= 5.0V; V
IN
= 2.5V; f = 1MHz; Note 4
V
CC
= 2.5V; V
IN
= 1.25V; f = 1MHz; Note 4
C
L
= 50pF; V
CC
= 5.0V; Input t
R
and t
F
<
5ns
C
L
= 50pF; V
CC
= 5.0V; Input t
R
and t
F
<
5ns
C
L
= 50pF; V
CC
= 5.0V; Input t
R
and t
F
<
5ns
V
CC
= 5V; Notes 3, 4, & 5
V
CC
= 5V; Notes 3, 4, & 6
Note 1: All parameters specified over standard operating conditions unless otherwise noted
Note 2: These parameters apply only to the SYNC drivers. Note that R
OUT
= R
T
+ R
BUFFER
.
Note 3: Per the IEC-61000-4-2 International ESD Standard, Level 4 contact discharge method. BYP and V
CC
must be bypassed to
GND via a low impedance ground plane with a 0.22μF, low inductance, chip ceramic capacitor at each supply pin. ESD
pulse is applied between the applicable pins and GND. ESD pulses can be positive or negative with respect to GND. Appli-
cable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_IN1, SYNC_IN2, DDC_IN1 and DDC_IN2. All pins are ESD pro-
tected to the industry standard
±2kV
Human Body Model (MIL-STD-883, Method 3015).
Note 4: This parameter is guaranteed by design and characterization.
Note 5: This specification applies to the SYNC_OUT pins only.
Note 6: Applicable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_IN1, SYNC_IN2, DDC_IN1 and DDC_IN2.
© 2006 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
02/21/06
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
