Issue X-1
CM1660
CM1660
Mechanical Details (cont’d)
uDFN Mechanical Specifications
The CM1660-DE is supplied in a 16-lead, 0.5mm pitch
uDFN package with Exposed End Pads (EEP). Dimen
sion are presented below.
For complete information on the uDFN-16, see the
California Micro Devices uDFN Package Information
document.
Mechanical Package Diagrams
D
16 15 14 13 12 11 10 9
PACKAGE DIMENSIONS
Package
JEDEC
No.
Leads
Dim.
A
A1
A3
b
D
D2
E
E2
e
K
L
M
# per
tape and
reel
0.20
0.20
0.30
0.25 REF
3000 pieces
0.40
0.20
3.90
3.10
1.50
0.30
Millimeters
Min
0.45
0.00
Nom
0.50
0.02
0.127 REF
0.25
4.00
3.20
1.60
0.40
0.50 BSC
0.30
4.10
3.30
1.70
0.50
Max
0.55
0.05
Min
0.018
0.000
0.008
0.153
0.122
0.059
0.012
0.008
0.008
0.010
0.012
uDFN
MO-229C
*
16
Inches
Nom
0.020
0.001
0.010
0.157
0.126
0.063
0.016
Max
0.022
0.002
0.012
0.161
0.130
0.067
0.020
0.08 C
Pin 1
Marking
E
1 2 3 4 5 6 7 8
TOP VIEW
0.10 C
0.005 REF
A1
SIDE VIEW
A
A3
16X
e
0.10
M
CAB
b
Pin 1
Locator
1
2
3
C0.2
4
5
6
7
8
E2
0.020 BSC
GND PAD
9
16 15 14 13 12 11 10
K
D2
0.010 REF
L
M
BOTTOM VIEW
Controlling dimension: millimeters
*
This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
Dimensions for 16-Lead, 0.5mm pitch uDFN
package with Exposed End Pads (EEP)
© 2007 California Micro Devices Corp. All rights reserved.
06/29/07
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
9