PRELIMINARY
CM1470
Mechanical Details
CM1470-04CP Mechanical Specifications
Mechanical Package Diagrams
Dimensions for the CM1470-04CP supplied in a 10-
bump, 0.4mm pitch chip scale package (CSP) are pre-
sented below.
OptiGuardTM Coated CSP
For complete information on the CSP-10, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
BOTTOM VIEW
OptiGuardTM
Coating
A1
C1
B1
PACKAGE DIMENSIONS
5
4
3
2
1
Package
Bumps
Custom CSP
10
Millimeters
Nom Max
Inches
Nom
Dim
A
A
B
B
Min
Min
Max
A1
A2
B1
B2
C1
C2
D1
D2
0.791 0.836 0.881 0.0311 0.0329 0.0347
1.985 2.030 2.075 0.0781 0.0799 0.0817
0.395 0.400 0.405 0.0156 0.0157 0.0159
0.395 0.400 0.405 0.0156 0.0157 0.0159
0.168 0.218 0.268 0.0066 0.0086 0.0106
0.165 0.215 0.265 0.0065 0.0085 0.0104
0.537 0.607 0.676 0.0211 0.0239 0.0266
0.368 0.419 0.470 0.0145 0.0165 0.0185
D1
D2
0.25 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1470-04CP Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
© 2006 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 03/15/06