PRELIMINARY
CM1451
Mechanical Details
CM1450-06CS/CP CSP Mechanical Specifications
CM1451-06CS/CP devices are packaged in a custom
Chip Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1
B1
C
B
A
B2
B4
B3
OptiGuard
TM
Coating
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
Millimeters
Min
Nom
Max
Min
Custom CSP
15
Inches
Nom
Max
A2
C2
1
2
3
4
5
6
D1
D2
2.915 2.960 3.005 0.1148 0.1165 0.1183
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.600 0.670 0.739 0.0236 0.0264 0.0291
0.394 0.445 0.495 0.0155 0.0175 0.0195
3500 pieces
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1451CS/CP Chip Scale Package
# per tape and
reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CM1451-06
CHIP SIZE (mm)
2.96 X 1.33 X 0.6
POCKET SIZE (mm)
B
0
X A
0
X K
0
3.10 X 1.45 X 0.74
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
10 Pitches Cumulative
Tolerance On Tape
±
0.2 mm
QTY PER
REEL
3500
P
0
4mm
P
1
4mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
P
1
User Direction of Feed
Center Lines
of Cavity
Figure 9. Tape and Reel Mechanical Data
©
2005 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/29/05
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
