CM1430
Mechanical Details (cont’d)
CM1430-08DF/DE Mechanical Specifications
Dimensions for the CM1430-08DF/DE supplied in a
16-lead, 0.4mm pitch TDFN package are presented
below.
For complete information on the TDFN-16, see the Cal-
ifornia Micro Devices TDFN Package Information doc-
ument.
E
Mechanical Package Diagrams
D
16 15 14 13 12 11 10 9
Pin 1
Marking
PACKAGE DIMENSIONS
Package
JEDEC
No.
Leads
Dim.
A
A1
A3
b
D
D2
E
E2
e
K
L
# per
tape and
reel
0.20
0.15
0.25
0.35
0.15
3.20
2.70
1.25
0.30
Millimeters
Min
0.70
0.00
Nom
0.75
0.02
0.200 REF
0.20
3.30
2.80
1.35
0.40
0.40 BSC
0.25
3.40
2.90
1.45
0.50
Max
0.80
0.05
Min
0.028
0.000
0.006
0.126
0.106
0.049
0.012
0.008
0.006
0.010
0.014
3000 pieces
TDFN
MO-229C
✝
16
Inches
Nom
0.030
0.001
0.008
0.130
0.110
0.053
0.016
Max
0.031
0.002
0.010
0.134
0.114
0.057
0.020
Pin 1
Locator
e
0.08 C
0.10 C
1 2 3 4 5 6 7 8
TOP VIEW
0.008 REF
A1
SIDE VIEW
A
A3
8X
0.10
M
CAB
b
1
2
3
C0.2
4
5
6
7
8
E2
0.016 BSC
K
GND PAD
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16 15 14 13 12 11 10
D2
L
BOTTOM VIEW
Controlling dimension: millimeters
✝
This package is compliant with JEDEC standard MO-229C with the
exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as
called out in the table above.
Dimensions for 16-Lead, 0.4mm pitch
TDFN package
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
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