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CM1426-06CS 参数 Datasheet PDF下载

CM1426-06CS图片预览
型号: CM1426-06CS
PDF下载: 下载PDF文件 查看货源
内容描述: 液晶显示器和照相机的EMI滤波器阵列与ESD保护 [LCD and Camera EMI Filter Array with ESD Protection]
分类和应用: 显示器
文件页数/大小: 13 页 / 757 K
品牌: CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
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PRELIMINARY  
CM1426  
Application Information  
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages  
offered by California Micro Devices.  
PRINTED CIRCUIT BOARD RECOMMENDATIONS  
PARAMETER  
VALUE  
0.275mm  
Pad Size on PCB  
Pad Shape  
Round  
Pad Definition  
Non-Solder Mask defined pads  
0.325mm Round  
0.125mm - 0.150mm  
0.330mm Round  
50/50 by volume  
No Clean  
Solder Mask Opening  
Solder Stencil Thickness  
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)  
Solder Flux Ratio  
Solder Paste Type  
Pad Protective Finish  
OSP (Entek Cu Plus 106A)  
+50μm  
Tolerance — Edge To Corner Ball  
Solder Ball Side Coplanarity  
+20μm  
Maximum Dwell Time Above Liquidous (183°C)  
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste  
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste  
60 seconds  
240°C  
260°C  
Non-Solder Mask Defined Pad  
0.275mm DIA.  
Solder Stencil Opening  
0.330mm DIA.  
Solder Mask Opening  
0.325mm DIA.  
Figure 10. Recommended Non-Solder Mask Defined Pad Illustration  
250  
200  
150  
100  
50  
0
1:00.0  
2:00.0  
3:00.0  
4:00.0  
Time (minutes)  
Figure 11. Eutectic (SnPb) Solder  
Ball Reflow Profile  
Figure 12. Lead-free (SnAgCu) Solder  
Ball Reflow Profile  
© 2005 California Micro Devices Corp. All rights reserved.  
10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112  
Tel: 408.263.3214  
Fax: 408.263.7846  
www.calmicro.com  
08/30/05