PRELIMINARY
CM1426
Mechanical Details
CSP Mechanical Specifications
CM1426 devices are supplied in custom Chip Scale
Packages (CSP). Dimensions are presented below.
For complete information on CSP packaging, see the
California Micro Devices CSP Package Information
document.
CM1426-04 Mechanical Specifications
The package dimensions for the CM1426-04 are pre-
sented below.
Mechanical Package Diagrams
PACKAGE DIMENSIONS
BOTTOM VIEW
Package
Bumps
Custom CSP
10
OptiGuardTM
Coating
A1
C1
B2
B1
Millimeters
Nom
Inches
Nom
Dim
Min
Max
Min
Max
C
B
A
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
1.915 1.960 2.005 0.0754 0.0772 0.0789
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.091 0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
1
2
3
4
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SIDE
VIEW
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1426-04
Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
B0 X A0 X K0
P0
P1
PART NUMBER
CHIP SIZE (mm)
CM1426-04
1.96 x 1.33 x 0.644
2.08 x 1.45 x 0.71
8mm
178mm (7")
3500
4mm 4mm
10 Pitches cumulative
tolerance on tape
P
o
±
0.2 mm
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
P
Center lines
of cavity
1
Concentric around B.
User direction of feed
Figure 13. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com 11
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
