CM1420/22
Mechanical Details
CM1420/22 devices are packaged in a custom Chip
Scale Packages (CSP). Dimensions for each of these
devices are presented in the following pages.
Mechanical Package Diagrams
CM1420 Mechanical Specifications
OptiGuardTM
Coating
BOTTOM VIEW
A1
The package dimensions for the CM1420 are pre-
sented below.
B2
B1
C1
C
B
A
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
15
1
2
3
4
5
6
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
Millimeters
Nom Max
Inches
Nom
Dim
SIDE
VIEW
Min
Min
Max
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
2.915 2.960 3.005 0.1148 0.1165 0.1183
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.600 0.670 0.739 0.0236 0.0264 0.0291
0.394 0.445 0.495 0.0155 0.0175 0.0195
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1420 Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
© 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
04/27/04
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
