PRELIMINARY
CM1418
Mechanical Details
CM1418 CSP Mechanical Specifications
The CM1418 is supplied in 6-bump Chip Scale Pack-
age (CSP). Dimensions are presented below.
Mechanical Package Diagrams
Non-Coated CSP
BOTTOM VIEW
A1
C1
B1
B2
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
C1
C2
D1
D2
D3
D4
Millimeters
Min
Nom
Max
Min
Custom CSP
6
Inches
Nom
Max
3
2
1
1.175 1.220 1.265 0.0463 0.0480 0.0498
1.675 1.720 1.765 0.0659 0.0677 0.0695
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.310 0.360 0.410 0.0122 0.0142 0.0161
0.310 0.360 0.410 0.0122 0.0142 0.0161
0.562 0.606 0.650 0.0221 0.0239 0.0256
0.356 0.381 0.406 0.0140 0.0150 0.0160
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
3500 pieces
A2
B
A
C2
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
OptiGuard
™
Coated CSP
BOTTOM VIEW
A1
C1
B1
3
2
1
B
A
C2
D3
A2
B2
# per tape and
reel
Controlling dimension: millimeters
OptiGuard
TM
Coating
D4
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1418-0xCS/CP
6-bump Chip Scale Package
© 2005 California Micro Devices Corp. All rights reserved.
12/13/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
7
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
