CM1407
Mechanical Details
TDFN-08 Mechanical Specifications
Mechanical Package Diagrams
Dimensions for the CM1407 device packaged in an 8-
lead TDFN package are presented below.
For complete information on the TDFN-08, see the Cal-
ifornia Micro Devices TDFN Package Information doc-
ument.
D
8 7 6 5
PACKAGE DIMENSIONS
Package
TDFN
✝
JEDEC
No.
MO-229 (Var. VCCD-3)
Pin 1
Marking
Leads
8
Millimeters
Nom
0.90
Inches
Nom
Dim.
Min
0.80
0.00
0.55
Max
Min
Max
1 2 3 4
TOP VIEW
A
A1
A2
A3
b
1.00 0.031 0.035 0.039
0.02
0.05 0.000 0.001 0.002
0.65
0.80 0.022 0.026 0.031
0.10
C
0.20
0.008
0.18
0.88
0.46
0.25
0.30 0.007 0.010 0.012
D
2.00
0.079
0.08
C
D2
E
0.98
1.08 0.035 0.039 0.043
A1
A
A3 A2
SIDE VIEW
2.00
0.079
E2
e
0.56
0.66 0.018 0.022 0.026
0.50
0.020
K
0.20
0.20
0.008
1 2 3 4
L
0.30
0.075
0.075
0.45 0.008 0.012 0.018
R
0.003
r1
D2
r1
0.003
NA
# per
tube
GND PAD
L
# per
tape and
reel
3000 pieces
R
8 7 6 5
K
Controlling dimension: millimeters
b
8X
e
✝
This package is compliant with JEDEC standard MO-229, variation
M
0.10
C A B
VCCD-3 with exception of the "D2" and "E2" dimensions as called
out in the table above and the "r1" dimension which is not specified
in the MO-229 standard.
BOTTOM VIEW
Package Dimensions for 8-Lead TDFN
© 2005 California Micro Devices Corp. All rights reserved.
08/03/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
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CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
