CM1406
Mechanical Details
TDFN-08 Mechanical Specifications
Mechanical Package Diagrams
Dimensions for CM1406-04DE/DF device packaged in
an 8-lead TDFN package are presented below.
For complete information on the TDFN-08 package,
see the California Micro Devices TDFN Package Infor-
mation document.
D
8 7 6 5
PACKAGE DIMENSIONS
Package
TDFN
✝
JEDEC
No.
MO-229 (Var. VCCD-3)
Pin 1
Marking
Leads
8
Millimeters
Nom
0.75
Inches
Nom
Dim.
Min
0.70
0.00
0.55
Max
Min
Max
1 2 3 4
TOP VIEW
A
A1
A2
A3
b
0.80 0.028 0.030 0.031
0.05 0.000 0.001 0.002
0.80 0.022 0.026 0.031
0.008
0.02
0.65
0.10
C
0.20
0.18
0.88
0.46
0.25
0.30 0.007 0.010 0.012
0.079
D
2.00
0.08
C
D2
E
0.98
1.08 0.035 0.039 0.043
0.079
A1
A
A3 A2
SIDE VIEW
2.00
E2
e
0.56
0.66 0.018 0.022 0.026
0.020
0.50
K
0.20
0.20
0.008
1 2 3 4
L
0.30
0.45 0.008 0.012 0.018
L2
R
0.13
0.005
r1
D2
0.075
0.075
0.003
0.003
r1
GND PAD
# per
tape and
reel
3000 pieces
L
R
Controlling dimension: millimeters
8 7 6 5
K
✝
b
e
This package is compliant with JEDEC standard MO-229, variation
8X
VCCD-3 with exception of the "D2" and "E2" dimensions as called
out in the table above and the "r1" dimension which is not specified
in the MO-229 standard.
M
0.10
C A B
BOTTOM VIEW
Package Dimensions for 8-Lead TDFN
© 2006 California Micro Devices Corp. All rights reserved.
01/31/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
11
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
