CM1406
Mechanical Details (Cont’d)
TDFN-16EEP Mechanical Specifications, 0.5mm
Mechanical Package Diagrams
The CM1406 is supplied in a 16-lead, 0.5mm pitch
TDFN package with Exposed End Pads (EEP). Dimen-
sion are presented below.
D
For complete information on the TDFN-16, see the
California Micro Devices TDFN Package Information
document.
16 15 14 13 12 11 10 9
Pin 1
PACKAGE DIMENSIONS
Marking
Package
TDFN
*
JEDEC
No.
MO-229C
1 2 3 4 5 6 7 8
TOP VIEW
Leads
16
Millimeters
Nom
Inches
Nom
Dim.
0.10
C
Min
0.70
0.00
Max
Min
Max
A
A1
A3
b
0.75
0.80 0.028 0.030 0.031
0.05 0.000 0.001 0.002
0.008 REF
0.08
C
0.02
0.20 REF
0.25
A1
A3
SIDE VIEW
0.20
3.90
3.10
1.50
0.30
0.30 0.008 0.010 0.012
4.10 0.153 0.157 0.161
3.30 0.122 0.126 0.130
1.70 0.059 0.063 0.067
0.50 0.012 0.016 0.020
0.020 BSC
A
D
4.00
16X
D2
E
3.20
M
0.10
C A B
e
b
1.60
E2
Pin 1
Locator
1
2
3
4
5
6
7
8
9
E2
e
0.40
0.50 BSC
C0.2
GND PAD
K
0.20
0.20
0.008
16 15 14 13 12 11 10
D2
L
0.30
0.40 0.008 0.010 0.012
0.010 REF
K
M
0.25 REF
L
# per
tape and
reel
3000 pieces
M
BOTTOM VIEW
Controlling dimension: millimeters
*
Dimensions for 16-Lead, 0.5mm pitch
TDFN package with Exposed End Pads (EEP)
This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
© 2007 California Micro Devices Corp. All rights reserved.
12
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
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www.cmd.com 04/11/07