CM1405
Mechanical Details
CM1405-01 Mechanical Specifications
Mechanical Package Diagrams
The package dimensions for the CM1405-01 are pre-
sented below.
BOTTOM VIEW
A1
SIDE
VIEW
C1
B2
B1
PACKAGE DIMENSIONS
C
B
A
Package
Bumps
Custom CSP
20
A
Millimeters
Nom Max
Inches
Nom
1
2
3
4
5
6
7
8
Dim
D1
D2
0.30 DIA.
Min
Min
Max
63/37 Sn/Pb (Eutectic) or
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
3.955 4.000 4.045 0.1557 0.1575 0.1593
1.413 1.458 1.503 0.0556 0.0574 0.0592
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.200 0.250 0.300 0.0079 0.0098 0.0118
0.244 0.294 0.344 0.0096 0.0116 0.0135
0.561 0.605 0.649 0.0221 0.0238 0.0255
0.355 0.380 0.405 0.0140 0.0150 0.0159
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1405-01 Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
© 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/16/04
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
