CM1402
CSP Mechanical Specifications
CM1402 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
B2
B1
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B4
B3
OptiGuard
TM
Coating
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
Millimeters
Min
Nom
Max
Min
Custom CSP
10
Inches
Nom
Max
C
B
A
1
2
3
4
C2
D1
D2
A2
1.915 1.960 2.005 0.0754 0.0772 0.0789
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071
0.091
0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
3500 pieces
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1402
Chip Scale Package
# per tape and
reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B
0
X A
0
X K
0
2.08 X 1.45 X 0.711
P
o
Top
Cover
Tape
PART NUMBER
CM1402
CHIP SIZE (mm)
1.96 X 1.33 X 0.644
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P
0
4mm
P
1
4mm
10 Pitches cumulative
tolerance on tape
±
0.2 mm
A
o
W
B
o
K
o
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P
1
User direction of feed
Center lines
of cavity
Figure 9. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
11/02/05
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
