CM1401-03
Mechanical Details
CSP Mechanical Specifications
The CM1401-03 is offered in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on the CSP, see the California
Micro Devices CSP Package Information document.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1
B1
C
B
A
B2
B4
B3
OptiGuard
TM
Coating
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
Millimeters
Min
Nom
Max
Min
Custom CSP
15
Inches
Nom
Max
A2
C2
1
2
3
4
5
6
D1
D2
2.915 2.960 3.005 0.1148 0.1165 0.1183
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
3500 pieces
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1401-03 Chip Scale Package
# per tape and
reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CM1401-03
CHIP SIZE (mm)
2.96 X 1.33 X 0.644
POCKET SIZE (mm)
B
0
X A
0
X K
0
3.10 X 1.45 X 0.74
P
o
Top
Cover
Tape
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P
0
4mm
P
1
4mm
10 Pitches Cumulative
Tolerance On Tape
±
0.2 mm
A
o
W
B
o
K
o
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
P
1
User Direction of Feed
Center Lines
of Cavity
Figure 11. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
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