CM1300
Mechanical Details
CSP Mechanical Specifications
The CM1300 is offered in a custom Chip Scale Pack-
age (CSP). Dimensions are presented below. For com-
plete information on CMD’s Chip Scale Packaging, see
the California Micro Devices CSP Package Information
document.
.
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
5
4
3
A2
B2
OptiGuard
TM
Coating
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
C1
C2
D1
D2
Millimeters
Min
0.940
2.440
0.495
0.495
Nom
0.985
2.485
0.500
0.500
Max
1.030
2.530
0.505
0.505
Min
Custom CSP
9
Inches
Nom
Max
0.0370 0.0388 0.0406
0.0961 0.0978 0.0996
0.0195 0.0197 0.0199
0.0195 0.0197 0.0199
2
1
B
A
C2
B
A
D1
0.30 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
SIDE
VIEW
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
0.575
0.368
0.644
0.419
0.714
0.470
0.0226 0.0254 0.0281
0.0145 0.0165 0.0185
3500 pieces
Controlling dimension: millimeters
Package Dimensions for
CM1300 9-bump Chip Scale Package
# per tape
and reel
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B
0
X A
0
X K
0
2.62 X 1.12 X 0.762
P
o
Top
Cover
Tape
PART NUMBER
CM1300
PKG. SIZE (mm)
2.485 X 0.985 X 0.644
TAPE WIDTH
W
8mm
REEL
DIA.
178mm (7")
QTY
PER
REEL
3500
P
0
4mm
P
1
4mm
10 Pitches Cumulative
Tolerance On Tape
±
0.2 mm
A
o
W
B
o
K
o
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P
1
User Direction of Feed
Center Lines
of Cavity
Figure 4. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
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