PRELIMINARY
CM1216
Mechanical Details
The CM1216 is supplied in SOIC-8, MSOP-8 and
MSOP-10 packages with a lead-free finishing option.
These package drawings are presented on the follow
pages.
SOIC-8 Mechanical Specifications
CM1216-06SN/SM devices are supplied in 8-pin SOIC
packages. Dimensions are presented below.
For complete information on the SOIC-8 package, see
the California Micro Devices SOIC Package Informa-
tion document.
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Mechanical Package Diagrams
TOP VIEW
D
7
6
5
PACKAGE DIMENSIONS
Package
Pins
Dimensions
A
A
1
B
C
D
E
e
H
L
# per tape
and reel
Millimeters
Min
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.40
Max
1.75
0.25
0.51
0.25
5.00
4.19
6.20
1.27
Min
0.053
0.004
0.013
0.007
0.189
0.150
0.228
0.016
SOIC
8
Inches
Max
0.069
0.010
0.020
0.010
0.197
0.165
0.244
0.050
END VIEW
SEATING
PLANE
SIDE VIEW
1
2
3
4
H
Pin 1
Marking
E
A
B
e
A
1
1.27 BSC
0.050 BSC
2500 pieces
Controlling dimension: inches
C
L
Package Dimensions for SOIC-8
©
2005 California Micro Devices Corp. All rights reserved.
06/30/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
7
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
