CM1209
Mechanical Details
CM1209 devices are packaged in 8-pin and 10-pin
MSOP and 8-pin SOIC packages. Dimensions for
these packages are presented on the following pages.
For complete information on the MSOP-8/-10 or SOIC-
MSOP-8 Mechanical Specifications
Mechanical Package Diagrams
TOP VIEW
8 packages, see the specific California Micro Devices
Package Information document.
PACKAGE DIMENSIONS
Package
Pins
Dimensions
A
A1
B
C
D
E
e
H
L
# per tube
# per tape
and reel
2.90
2.90
4.78
0.52
Millimeters
Min
0.87
0.05
0.18
3.10
3.10
4.98
0.54
0.114
0.114
0.188
0.017
Max
1.17
0.25
Min
0.034
0.002
MSOP
8
Inches
Max
0.046
0.010
D
8
7
6
5
0.30 (typ)
0.012 (typ)
0.007
0.122
0.122
H
Pin 1
Marking
E
0.65 BSC
0.025 BSC
0.196
0.025
1
2
3
4
SIDE VIEW
80 pieces*
4000 pieces
Controlling dimension: inches
SEATING
PLANE
A
A1
B
e
END VIEW
* This is an approximate number which may vary.
C
L
Package Dimensions for MSOP-8
© 2004 California Micro Devices Corp. All rights reserved.
01/09/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
7
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
