CM1206
Mechanical Details (cont’d)
CM1206-08 10-bump CSP Mechanical Specifications
The CM1206-08 devices are packaged in a 6-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
B2
OptiGuard
TM
Coating
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
C1
C2
D1
D2
Millimeters
Min
Nom
Max
Min
Custom CSP
10
Inches
Nom
Max
4
3
2
1
5
1.109 1.154 1.199 0.0437 0.0454 0.0472
3.059 3.104 3.149 0.1204 0.1222 0.1240
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.645 0.650 0.655 0.0254 0.0256 0.0258
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.202 0.252 0.302 0.0080 0.0099 0.0119
0.638 0.707 0.776 0.0251 0.0278 0.0306
0.394 0.445 0.495 0.0155 0.0175 0.0195
3500 pieces
A2
B
A
C2
B
A
D1
D2
SIDE
VIEW
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
# per tape and
reel
Controlling dimension: millimeters
Package Dimensions for
CM1206-08 10-bump Chip Scale Package
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B
0
X A
0
X K
0
3.28 X 1.32 X 0.81
P
o
Top
Cover
Tape
PART NUMBER
CM1206-08
CHIP SIZE (mm)
3.104 X 1.154 X 0.707
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY
PER
REEL
3500
P
0
4mm
P
1
4mm
10 Pitches Cumulative
Tolerance On Tape
±
0.2 mm
A
o
W
B
o
K
o
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P
1
User Direction of Feed
Center Lines
of Cavity
Figure 5. Tape and Reel Mechanical Data
©
2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
06/28/04
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
