CM1204
Mechanical Details
CSP Mechanical Specifications
CM1204 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
Mechanical Package Diagrams
OptiGuard
™
Coated CSP
BOTTOM VIEW
A1
C1
B2
B1
C
A2
B
OptiGuard
TM
Coating
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
Millimeters
Min
0.915
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.600
0.394
Nom
0.960
1.330
0.500
0.250
0.435
0.435
0.230
0.230
0.670
0.445
Max
1.005
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.739
0.495
Min
Custom CSP
5
Inches
Nom
Max
0.0360 0.0378 0.0396
0.0506 0.0524 0.0541
0.0195 0.0197 0.0199
0.0096 0.0098 0.0100
0.0169 0.0171 0.0173
0.0169 0.0171 0.0173
0.0071 0.0091 0.0110
0.0071 0.0091 0.0110
0.0236 0.0264 0.0291
0.0155 0.0175 0.0195
3500 pieces
B4
B3
A
1 2 3
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1204 Chip Scale Packages
C2
D1
D2
SIDE
VIEW
# per tape and
reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CM1204
CHIP SIZE (mm)
1.33 X 0.96 X 0.670
POCKET SIZE (mm)
B
0
X A
0
X K
0
1.42 X 1.07 X 0.740
P
o
Top
Cover
Tape
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P
0
4mm
P
1
4mm
10 Pitches Cumulative
Tolerance On Tape
±
0.2 mm
A
o
W
K
o
B
o
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P
1
User Direction of Feed
Center Lines
of Cavity
Figure 5. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
05/10/04