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210R1602X 参数 Datasheet PDF下载

210R1602X图片预览
型号: 210R1602X
PDF下载: 下载PDF文件 查看货源
内容描述: 薄膜系列 [THIN FILM SERIES]
分类和应用:
文件页数/大小: 1 页 / 396 K
品牌: CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
   
CALIFORNIA MICRO DEVICES
210R
THIN FILM RESISTOR SERIES
California Micro Devices’ 210R Series multi-terminal resistor chip offers the hybrid designer a component that provides a
wide range of resistance values on a single chip. Bonding pads segment the total resistance into five single elements of
resistance and seven 5X elements of resistance enabling the combination to cover the resistance range from 800 ohms to
240K ohms.
Parameter
TCR
Operating Voltage
Package
ating per re
Power R
Power
(
Rating
sistor)
Thermal Shock
High Temperature Exposure
Moisture Resistance
Life
Noise
Insulation Resistance
ELECTRICAL SPECIFICATIONS
Test Condition
-55°C to +125°C
-55°C to +125°C
@ 70°C (D erate linearly to zero @ 150° C )
Method 107 MIL-STD -202F
100 Hrs @ 150° C A m b i e n t
Method 106 MIL-STD -202F
Method 108 MIL-STD -202F (125° C / 1 0 0 0 h r )
Method 308 MIL-STD -202F
@ 25° C
0 to -250ppm/°C
100Vdc
250mw
±0.25% @
∆R
±0.25%
∆R
±0.5%
∆R
±0.5%
∆R
-20dB
1
×
1 0
12
Max
Max
Max
Max
Max
Max
Max
Max
Min
PAD 1
PAD 13
PAD 8
Part Number
2 10 R
2 10 R
2 10 R
2 10 R
2 10 R
2 10 R
8000X
2 40 0 X
8 0 0 1X
8002X
16 0 2 X
2 40 3 X
VALUES
Total
Nominal/Single
Resistance
Element of Resistance
800
2 40 0
8000
80000
16 0 0 0 0
2 40 0 0 0
20
60
200
2000
40 0 0
6000
Formats
Die Size:
30±3 mils square
Bonding Pads:
4x4 mils typical
MECHANICAL SPECIFICATIONS
Substrate
Isolation Layer
Backing
Metalization
Silicon 10±2 mils thick
S
i
0
2
100,000Å thick, min
Lapped (gold optional)
Aluminum 10,000Å thick, min
(15,000Å gold optional)
PACKAGING
Two inch square trays of 400 chips maximum.
NOTE S
1. The tolerance applies to the total resistance value only.
2. Resistor pattern may vary from one value to another.
210R
Series
8502
Value
First 3 digits are
significant value.
Last digit represents
number of zeros.
R indicates decimal point
PART NUMBER DESIGNATION
X
G
Tolerance
J = ±5%
K = ±10%
M = ±20%
Bond Pads
G = Go l d
No Letter = Aluminum
Backing
W = Go l d
L = Lapped
No Letter = Either
W
© 2002 California Micro Devices Corp. All rights reserved.
3/02
C0740400
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com