Data Sheet
1
IN1
OUT1
8
75Ω
220µF
75Ω
Video Cables
2.5
75Ω
IN2
OUT2
Maximum Power Dissipation (W)
2
7
75Ω
220µF
75Ω
2
CLC3800
3
IN3
OUT3
6
75Ω
220µF
75Ω
1.5
C
omlinear
CLC3800, CLC3801, CLC3802
Triple,
Standard Definition Video Amplifiers
4
+Vs
GND
5
1
SOIC-8
AC-Coupling Caps
are Optional
0.5
Figure 3. Typical Output Configuration
Power Supply Decoupling
For optimum performance, power supply decoupling is re-
quired. Figure 4 shows the recommended usage of power
supply decoupling capacitors. The 0.1µF decoupling ca-
pacitor must be placed as close to pin 4 as possible, <
0.1” or < 2.5mm, to be effective. The larger, 1µF capaci-
tor can be placed further away.
0
-40
-20
0
20
40
60
80
Ambient Temperature (°C)
Figure 5. Maximum Power Derating
1
IN1
OUT1
8
2
IN2
OUT2
7
CLC3800
3
IN3
OUT3
6
+3V or +5V
4
+Vs
GND
5
Power Dissipation Considerations with DC-Coupled Loads
When driving DC loads, the supply current is much higher
than in AC applications and care must be taken to dis-
sipate the extra heat generated. The output signal will
swing from about 0.3V to 2.3V for full swing video. In
the worst case condition, an all white screen with dual DC
loads, the additional thermal rise over the quiescent con-
dition is about 20°C. An easy way to help distribute this
extra heat is to place a ground plane under the part and
add ground plane on the bottom of the board immediately
under the part with vias between the two planes.
The CLC3800 is designed primarily for low voltage opera-
tion with supply values between 3.0V and 5.5V, but larger
supplies can be used. In this situation, DC loads may not
be possible due to thermal considerations. With single DC
loads on all three channels and a 12V supply, the thermal
rise is an additional 45° this gives a total temperature rise
of about 57°.
1.0µF
0.1µF
Figure 4. Recommended Power Supply Decoupling
Power Dissipation
TBD
Rev 1A
©2007-2008 CADEKA Microcircuits LLC
www.cadeka.com
7