Data Sheet
Mechanical Dimensions
QFN-64 Package
Inches
Typ
Millimeters
Typ
aaa
C
A
ccc C
Symbol
Min
Max
Min
Max
A
D
A
A
–
0.00
–
–
0.035
0.002
0.028
–
0.00
–
–
0.01
0.65
0.2 REF
0.25
9.00 BSC
8.75 BSC
5.2
9.00 BSC
8.75 BSC
5.2
0.9
0.05
0.7
A2
A3
A
A
A
0.0004
0.026
1
2
3
D1
0.008 REF
0.010
0.354 BSC
0.354 BSC
0.205
0.354 BSC
0.344 BSC
0.205
b
D
0.008
0.197
0.197
0.012
0.213
0.213
0.2
5.0
5.0
0.30
5.4
aaa
C B
A1
D
1
D
2
E
E
1
E
2
5.4
F
G
L
0.05
0.0096
0.012
–
0.0168
0.016
0.020 BSC
–
–
1.3
0.24
0.3
–
0.42
0.4
0.50 BSC
–
–
0.6
0.5
0.024
0.020
e
θ
0°
12°
0°
12°
1
E
E1
Tolerance of Form and Position
aaa
bbb
ccc
0.10
0.10
0.05
0.004
0.004
0.002
Pin 1 ID
0.05 Dia.
NOTES:
1. All dimensions are in millimeters.
2. Die thickness allowable is 0.305mm maximum (.012 inches maximum)
3. Dimensioning & tolerances conform to ASME y14.5m. -1994.
4. Dimension applies to plated terminal and is measured between 0.20 and 0.25mm from terminal tip.
5. The pin #1 identifier must be placed on the top surface of the package by using indentation mark
or other feature of package body.
seating
plane
θ1
1.14
bbb C
B
6. Exact shape and size of this feature is optional.
C
7. Package warpage max 0.08mm.
B
bbb C A
1.14
8. Applied for exposed pad and terminals. Exclude embedding part of exposed pad from measuring.
9. Applied only to terminals.
TOP VIEW
SIDE VIEW
10. Package corners unless otherwise specipied are r0.175±0.025mm.
F
D2
Pin 1 ID
Dia. 0.20
0.45
G
E2
L
e
b
L
0.10 M
C A B
BOTTOM VIEW
©2009 CADEKA Microcircuits LLC
www.cadeka.com
15
CADEKA [ CADEKA MICROCIRCUITS LLC. ]
