Data Sheet
Mechanical Dimensions
QFN-64 Package
Inches
Typ
–
0.0004
0.026
0.008 REF
0.010
0.354 BSC
0.354 BSC
0.157
Millimeters
Typ
–
0.01
0.65
0.2 REF
0.25
9.00 BSC
8.75 BSC
3.99
aaa
C
A
ccc C
Symbol
A
Min
–
0.00
–
Max
0.035
0.002
0.028
Min
–
0.00
–
Max
0.9
0.05
0.7
A
D
A
A2
A3
A
1
A
2
A
3
D1
b
D
0.008
0.149
0.012
0.165
0.2
0.30
4.19
aaa
C B
A1
D
1
D
3.79
2
E
0.354 BSC
0.344 BSC
0.157
9.00 BSC
8.75 BSC
3.99
E
E
1
0.149
0.012
0.165
0.020
3.79
0.3
4.19
0.5
2
L
0.016
0.4
e
0.020 BSC
–
0.50 BSC
–
θ
0°
12°
–
0°
12°
–
1
R
0.004
–
0.10
–
Tolerance of Form and Position
E
E1
aaa
bbb
ccc
0.10
0.10
0.05
0.004
0.004
0.002
NOTES:
1. All dimensions are in millimeters.
0.05 Dia. R
1.14
2. Die thickness allowable is 0.305mm maximum (.012 inches maximum)
3. Dimensioning & tolerances conform to ASME y14.5m. -1994.
4. Dimension applies to plated terminal and is measured between 0.20 and 0.25mm from terminal tip.
5. The pin #1 identifier must be placed on the top surface of the package by using indentation mark
or other feature of package body.
seating
plane
θ1
bbb C
B
6. Exact shape and size of this feature is optional.
7. Package warpage max 0.08mm.
C
8. Applied for exposed pad and terminals. Exclude embedding part of exposed pad from measuring.
9. Applied only to terminals.
B
bbb C A
1.14
10. Package corners unless otherwise specipied are r0.175±0.025mm.
TOP VIEW
SIDE VIEW
D2
Pin 1 ID
0.20 R
0.42
±0.18
0.45
R
0.42
±0.18
E2
L
e
b
L
0.10 M
C A B
BOTTOM VIEW
©2009 CADEKA Microcircuits LLC
www.cadeka.com
15
CADEKA [ CADEKA MICROCIRCUITS LLC. ]
