BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-BEG202
●
Features:
1. Chip material: GaAsP/GaP (Red)
and GaP/GaP (Green)
2. Emitted color : Hi-Eff Red and Green
3. Lens Appearance : White Diffused
4. Low power consumption.
5. High efficiency.
6. Versatile mounting on P.C. Board or panel.
7. Low current requirement.
8. 4mm diameter package.
9. This product don’t contained restriction
substance, compliance ROHS standard.
●Package
dimensions
4.00(.158)
CENTER LEADS
COMMON CATHODE
1.0(.039)
6.00(.236)
1.50(.059)
MAX.
1.2 0.5
(.047 .020)
21.0(.827) MIN.
Hi-Eff Red
ANODE
Green
ANODE
0.5(.02)
SQ. TYP.
2.0(.080)MIN.
4.60(.181)
2.54(.100) 2.54(.100)
NOM.
NOM.
●
Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
●
Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Forward Current
Symbol
Pd
I
F
Hi-Eff Red
80
30
Green
80
30
Unit
mW
mA
mA
V
Peak Forward Current*
1
Reverse
Voltage
Operating Temperature
Storage Temperature
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http://www.brtled.com
I
FP
150
150
V
R
5
Topr
Tstg
Tsol
-40
℃
~80
℃
-40
℃
~85
℃
260
℃
(for 5 seconds)
Soldering Temperature
*
1
Condition for I
FP
is pulse of 1/10 duty and 0.1msec width.
Ver.1.0 Page: 1 of 2
BRIGHT [ BRIGHT LED ELECTRONICS CORP ]
