TISP61089 Gated Protector Series
MECHANICAL DATA
P008 Plastic Dual-In-Line Package
This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions The package is intended for insertion in mounting-hole rows on 7.62 (0.300) centers. Once the leads are compressed and
inserted, sufficient tension is provided to secure the package in the board during soldering. Leads require no additional cleaning or processing
when used in soldered assembly.
P008
9.25 - 9.75
(.364 - .384)
8
7
6
5
Index
Notch
6.10 - 6.60
(.240 - .260)
1
2
3
4
1.78
MAX.
(.070)
4 Places
7.62 - 8.23
(.300 - .324)
5.08
MAX.
(.200)
Seating
Plane
0.51
MIN.
(.020)
3.17
MIN.
(.125)
0.20 - 0.36
(.008 - .014)
0.38 - 0.53
(.015 - .021)
8 Places
MILLIMETERS
(INCHES)
2.54
TYP.
(.100)
(see Note A)
6 Places
8.38 - 9.40
(.330 - .370)
DIMENSIONS ARE:
MDXXCF
NOTES: A. Each pin centerline is located within 0.25 (0.010) of its true longitudinal position.
B. Dimensions fall within JEDEC MS001 - R-PDIP-T, 0.300" Dual-In-Line Plastic Family.
C. Details of the previous dot index P008 package style, drawing reference MDXXABA, are given in the earlier publications.
NOVEMBER 1995 - REVISED AUGUST 2002
Specifications are subject to change without notice.
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