TISP4xxxM3LM Overvoltage Protector Series
MECHANICAL DATA
LM002 (DO-92) - Formed Leads Version- 2-Pin Cylindrical Plastic Package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
LMF002 (DO-92) - Formed Leads Version of LM002
4.44 - 5.21
(.175 - .205)
3.17 - 4.19
(.125 - .165)
3.43
MIN.
(.135)
2.03 - 2.67
2.03 - 2.67
(.080 - .105)
(.080 - .105)
4.32 - 5.34
(.170 - .210)
2.20
(.086)
MAX.
4.00
(.157)
MAX.
A
2
2
0.40 - 0.56
(.016 - .022)
1
3
3
1
VIEW A
2.40 - 2.90
(.094 - .114)
0.35 - 0.41
(.014 - .016)
2.40 - 2.90
(.094 - .114)
METRIC
(INCHES)
DIMRNSIONS ARE:
MD4XASA
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
BOURNS [ BOURNS ELECTRONIC SOLUTIONS ]
