oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
■
Low height of 5.65 mm
Applications
■
Telecom
SM
YYW 7505
W 7
*R
■
Operating temperature -40 °C to +85 °C
■
Lead free version available (see How to
Order)
■
Lead free versions are RoHS compliant*
SM75057E - T1/E1 Transformer
Electrical Specifications @ 25
°C
OCL (1-3)
mH min. @ 10 kHz, 0.1 V ................1.2
OCL (6-8)
mH min. @ 10 kHz, 0.1 V ................1.2
OCL (1-3)
µH min. @ 10 kHz, 0.1 V,
(-40 °C to +85 °C) ..........................600
OCL (6-8)
µH min. @ 10 kHz, 0.1 V,
(-40 °C to +85 °C) ..........................600
L
L
(1-3)
µH max. @ 100 kHz, 0.1 V
short (16-14) ....................................0.6
L
L
(6-8)
µH max. @ 100 kHz, 0.1 V
short (11-9) ......................................0.6
Cww (16-1)
pF max. @ 100 kHz, 0.1 V ................30
Cww (11-6)
pF max. @ 100 kHz, 0.1 V
30 Turns Ratio
(1-3) : (16-14) ......................1 : 2 ±2 %
(6-8) : (11-9) ........................1 : 2 ±2 %
DCR (1-3) ..........................0.5 to 0.8 ohm
DCR (6-8) ..........................0.5 to 0.8 ohm
DCR (16-14) ......................0.9 to 1.6 ohm
DCR (11-9) ........................0.9 to 1.6 ohm
Polarity (1, 16, 6, 11) ............Same phase
HIPOT
Between Windings................2000 VAC
Packaging Specifications
Tape & Reel..........................700 pcs./reel
Product Dimensions
12.70
MAX.
(.500)
16
9.40
MAX.
(.370)
9
Electrical Schematic
1
16
SM75057
(DATE)
1
8
7.00
MAX.
(.276)
3
6
14
11
1.27
(.050)
8.89
(.350)
8
9
5.65
MAX.
(.222)
0.51
(.020)
16 PLCS.
Soldering Profile
240
°C
4
°C/S
150
°C
COOLING
IN STILL AIR
0.25
(.010)
0
°
-8
°
45 S
MAX.
90 S
MAX.
30 S
MAX.
SOLDERING
COOLING
PREHEATING
8.89
(.350)
1.91
(.075)
8.33
(.328)
1.27
(.050)
How to Order
SM75057E __
Model
Termination
Blank = Tin-lead
L = Tin only (lead free)
16X
0.74
±
0.03
(.029
±
.001)
Recommended PAD layout
DIMENSIONS ARE:
MM
(INCHES)
TOLERANCE: ±
0.254
(.010)
02/06
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.