TBU
™
P650-U and P850-U Protectors
Product Dimensions
L
E
B
J
C
K
F
G
N
J
Dim.
A
B
Min.
6.15
(.242)
7.65
(.301)
0.80
(.031)
0.000
(.000)
0.50
(.020)
1.20
(.047)
4.20
(.165)
2.45
(.096)
0.20
(.008)
0.45
(.018)
0.65
(.026)
0.20
(.008)
0.70
(.028)
3.20
(.126)
DIMENSIONS:
Typ.
6.25
(.246)
7.75
(.305)
0.85
(.033)
0.025
(.001)
0.55
(.022)
1.25
(.049)
4.25
(.167)
2.50
(.098)
0.25
(.010)
0.50
(.020)
0.70
(.028)
0.25
(.010)
0.75
(.030)
3.25
(.128)
MM
(INCHES)
Max.
6.35
(.250)
7.85
(.309)
0.90
(.035)
0.050
(.002)
0.60
(.024)
1.30
(.051)
4.30
(.169)
2.55
(.100)
0.30
(.012)
0.55
(.022)
0.75
(.030)
0.30
(.012)
0.80
(.031)
3.30
(.130)
4
A
5
6
H
C
P
3
2
1
D
E
H
PIN 1
D
N
F
G
H
J
K
L
N
P
Q
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Recommended Pad Layout
2.525
(.099)
0.50
(.020)
0.575
(.023)
1.25
(.049)
0.70
(.028)
4.275
(.168)
0.375
(.015)
Pad Designation
Pad #
Apply
1
In1
2
NC
3
Out1
4
Out2
5
NC
6
In2
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
TBU
™
devices have matte-tin termination finish. Suggested layout should use non-solder mask
define (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil
opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power
device, it is recommended that, wherever possible, extra PCB copper area is allowed. For mini-
mum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the
pads of the device.
Block Diagram
6
4
3
TBU™ Device
Load
Side
Thermal Resistances
Symbol
R
th(j-a)
Parameter
Junction to leads (package)
Junction to leads (per TBU)
Value
105
202
Unit
°C/W
°C/W
Line
Side
1
Reflow Profile
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
BOURNS [ BOURNS ELECTRONIC SOLUTIONS ]
