TBU
™
P500-G and P850-G Protectors
Thermal Resistances
Part #
P500-G
Symbol
R
th(j-a)
Parameter
Junction to leads (package)
Junction to leads (per TBU
™
device)
Junction to leads (package)
Junction to leads (per TBU
™
device)
Value
113
236
119
215
Unit
°C/W
°C/W
°C/W
°C/W
P850-G
R
th(j-a)
Reflow Profile
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
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