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MF-MSMF150-2 参数 Datasheet PDF下载

MF-MSMF150-2图片预览
型号: MF-MSMF150-2
PDF下载: 下载PDF文件 查看货源
内容描述: 表面贴装包装自动化装配 [Surface mount packaging for automated assembly]
分类和应用:
文件页数/大小: 5 页 / 319 K
品牌: BOURNS [ BOURNS ELECTRONIC SOLUTIONS ]
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MF-MSMF Series - PTC Resettable Fuses
Product Dimensions (see previous page for dimensions)
Style 1
Top and Bottom View
A
Side View
C
Recommended Pad Layout
1.5 ± 0.05
(.059 ± .002)
1.5 ± 0.05
(.059 ± .002)
3.2 ± 0.1
(0.126 ± .004)
2.7 ± 0.1
(.106 ± .004)
D
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
B
Style 2
Top View
Bottom View
A
Side View
C
Recommended Pad Layout
8
C
D
B
2.95 ± 0.10
(.114 ± .004)
1.68 ± 0.05
(.066 ± .002)
3.1 ± 0.10
(.122 ± .004)
Typical Time to Trip at 23 ˚C
100
MF-MSMF010
MF-MSMF200
10
MF-MSMF030
The Time to Trip curves represent typical
performance of a device in a simulated
application environment. Actual performance
in specific customer applications may differ
from these values due to the influence of
other variables.
Time to Trip (Seconds)
1
MF-MSMF260
0.1
MF-MSMF160
MF-MSMF150
MF-MSMF125
0.01
MF-MSMF110
MF-MSMF075
MF-MSMF014
MF-MSMF020
MF-MSMF075/24
MF-MSMF110/16
0.001
0.1
1
MF-MSMF050
10
100
Fault Current (Amps)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.