Features
■
■
■
■
■
Applications
High Density Circuit Board Applications:
■
Hard disk drives
■
PC motherboards
■
PC peripherals
■
Point-of-sale (POS) equipment
■
PCMCIA cards
4.5 mm SMD
Fast tripping resettable circuit protection
Surface mount packaging for automated
assembly
Reduced component size and resistance
Agency recognition:
T V Rheinland
MF-MSMD Series -
PTC Resettable Fuses
Electrical Characteristics
Tripped
Power
Dissipation
Ihold
Model
V max.
Volts
I max.
Amps
Itrip
Resistance
Ohms
at 23 °C
RMin.
R1Max.
Max. Time
To Trip
Amperes
at 23 °C
Seconds
at 23 °C
Amperes
at 23 °C
Hold
Trip
Watts
at 23 °C
Typ.
MF-MSMD010
MF-MSMD014
MF-MSMD020
MF-MSMD030
MF-MSMD050
MF-MSMD075
MF-MSMD110
MF-MSMD125
MF-MSMD150
MF-MSMD160
MF-MSMD200
MF-MSMD260
60.0
60.0
30.0
30.0
15.0
13.2
6.0
6.0
6.0
8.0
6.0
6.0
40
40
80
10
100
100
100
100
100
100
100
100
0.10
0.14
0.20
0.30
0.50
0.75
1.10
1.25
1.50
1.60
2.00
2.60
0.30
0.34
0.40
0.60
1.00
1.50
2.20
2.50
3.00
2.80
4.00
5.20
0.70
0.40
0.40
0.30
0.15
0.11
0.04
0.035
0.03
0.035
0.020
0.015
15.00
6.50
6.00
3.00
1.00
0.45
0.21
0.14
0.120
0.099
0.100
0.080
0.5
1.5
6.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
1.5
0.15
0.06
0.10
0.15
0.20
0.30
0.4
0.5
2.0
3.0
5.0
1.0
1.0
1.0
1.2
1.2
1.2
1.2
1.5
1.5
1.5
1.5
1.5
Environmental Characteristics
Operating/Storage Temperature ........................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change
Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours....................±5 % typical resistance change
Thermal Shock ....................................................+85 °C to -40 °C, 20 times ..........................±10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Test Procedures And Requirements For Model MF-MSMD Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C ............................................................Rmin
≤
R
≤
R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T
≤
max. time to trip (seconds)
Hold Current....................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................MIL-STD-202F, Method 208F..........................................95 % min. coverage
UL File Number ..................................E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number ................................CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000
TÜV Certificate Number......................R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
BOURNS [ BOURNS ELECTRONIC SOLUTIONS ]
