CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors
Packaging Specifications
CM10, CM16, CM20, CM25, CM32
t1
flDo
E
P3
CM45
t1
flDo
E
P3
F
W
B
D1
DIA.
P2
P1
A
Tape running direction
t2
W
F
B
t2
Chip
Component
Chip
Component
P2
P1
A
Tape running direction
Model
CM10
CM16
CM20
CM25
CM32
CM45
A
B
W
F
E
P1
P2
2.00 (.079)
2.00 (.079)
2.00 (.079)
2.00 (.079)
2.00 (.079)
2.00 (.079)
P3
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
4.00 (.157)
øD0
øD1
t1
t2
1.20 (.047)
1.20 (.047)
1.55 (.061)
1.85 (.073)
2.40 (.094)
3.50 (.138)
0.71 (.027) 1.21 (.047) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)
1.00 (.039) 1.80 (.071) 8.00(.315)
1.45 (.057) 2.25 (.089) 8.00(.315)
2.40 (.094) 2.90 (.114) 8.00(.315)
2.80 (.110) 3.60 (.142) 8.00(.315)
3.50 (.138) 1.75 (.069) 4.00 (.157)
3.50 (.138) 1.75 (.069) 4.00 (.157)
3.50 (.138) 1.75 (.069) 4.00 (.157)
3.50 (.138) 1.75 (.069) 4.00 (.157)
1.50 (.059) 0.60 (.024) 0.27 (.011)
1.50 (.059) 0.60 (.024) 0.27 (.011)
1.50 (.059) 1.00 (.039) 0.25 (.010)
1.50 (.059) 1.10 (.043) 0.25 (.010)
1.50 (.059)
1.50 (.059)
—
—
0.25 (.010)
0.30 (.012)
3.60 (.142) 4.90 (.193) 12.00(.472) 5.50 (.217) 1.75 (.069) 8.00 (.315)
Reel Dimensions
Model
CM10
CM16
CM20
CM25
CM32
CM45
A
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
178 (7.008)
B
C
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
60 min. 13 (.512)
D
21 (.827)
21 (.827)
21 (.827)
21 (.827)
21 (.827)
21 (.827)
E
2 (.079)
2 (.079)
2 (.079)
2 (.079)
2 (.079)
W
9 (.354)
9 (.354)
9 (.354)
9 (.354)
9 (.354)
D
E
C
B
2 (.079) 13 (.512)
Packaging
Model
CM10
CM16
CM20
Quantity
10000 pcs
3000 pcs
3000 pcs
Weight
150g
90g
90g
Model
CM25
CM32
CM45
Quantity
2000 pcs
2000 pcs
500 pcs
Weight
100g
190g
100g
A
W
Soldering
Flow Soldering
Infra-red
260°C maximum for 5 seconds (2 wave solder method)
200°C for a maximum of 30 seconds. Peak of 240°C for a maximum of 5 seconds.
If the solder does not reflow simultaneously under each terminal, there may be a misalignment of the component on the
board. For this reason, it is recommended that the inductor be adhered to the board prior to reflow.
Vapor-phase
215°C for a maximum of 30 seconds.
Flow Soldering
10 seconds max.
260°C
Infra-red Soldering
10 seconds max.
230°C
Vapor-phase Soldering
10 seconds max.
220°C
200°C
Preheat:
100 to 150°
2 minutes
min.
Preheat:
100 to 150°
2 minutes
min.
30 seconds max.
Preheat:
100 to 150°
2 minutes
min.
30 seconds max.
215°C
Specifications are subject to change without notice.
BOURNS [ BOURNS ELECTRONIC SOLUTIONS ]
