ChipGuard
®
MLA Series Varistor ESD Clamp Protectors
Product Dimensions
A
W
Recommended Pad Layout
A
L
B
DIMENSIONS =
MM
(INCHES)
C
D
B
Dimension
L
W
A
B
CG0402MLA
Series
1.00 ± 0.15
(0.04 ± 0.006)
0.50 ± 0.10
(0.02 ± 0.004)
0.50 ± 0.10
(0.02 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
CG0603MLA
Series
1.60 ± 0.20
(0.064 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.30 ± 0.20
(0.012 ± 0.008)
Dim.
A
B
C
D
CG0402MLA
Series
0.51
(0.020)
0.61
(0.024)
0.51
(0.020)
1.70
(0.067)
CG0603MLA
Series
0.76
(0.030)
1.02
(0.040)
0.50
(0.020)
2.54
(0.100)
Solder Reflow Recommendations
300
250
200
150
100
50
0
110 sec. (min.)
30-70
sec.
Time (seconds)
120 sec. (min.)
Preheat Stages 1-3
Soldering
Cooling
A
B
C
D
Stage 1 Preheat Ambient to Preheating 30 s to 60 s
Temperature
Stage 2 Preheat 140 °C to 160 °C
Stage 3 Preheat Preheat to 200 °C
Main Heating
200
210
220
230
240
°C
°C
°C
°C
°C
60 s to 120 s
20 s to 40 s
60
55
50
40
30
s
s
s
s
s
to
to
to
to
to
70
65
60
50
40
s
s
s
s
s
Temperature (°C)
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under
30 watts is recommended.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
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