ChipGuard
®
MLE Series Varistor ESD Clamp Protectors
Product Dimensions
A
W
Recommended Pad Layout
A
L
B
DIMENSIONS =
MM
(INCHES)
C
D
B
Dimension
L
W
A
B
CG0402MLE
Series
1.00 ± 0.15
(0.04 ± 0.006)
0.50 ± 0.10
(0.02 ± 0.004)
0.50 ± 0.10
(0.02 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
CG0603MLE
Series
1.60 ± 0.20
(0.064 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.30 ± 0.20
(0.012 ± 0.008)
Dim.
A
B
C
D
CG0402MLE
Series
0.51
(0.020)
0.61
(0.024)
0.51
(0.020)
1.70
(0.067)
CG0603MLE
Series
0.76
(0.030)
1.02
(0.040)
0.50
(0.020)
2.54
(0.100)
Solder Reflow Recommendations
300
250
200
150
100
50
0
110 sec. (min.)
30-70
sec.
Time (seconds)
120 sec. (min.)
Preheat Stages 1-3
Soldering
Cooling
A
B
C
D
Stage 1 Preheat Ambient to Preheating 30 s to 60 s
Temperature
Stage 2 Preheat 140 °C to 160 °C
Stage 3 Preheat Preheat to 200 °C
Main Heating
200
210
220
230
240
°C
°C
°C
°C
°C
60 s to 120 s
20 s to 40 s
60
55
50
40
30
s
s
s
s
s
to
to
to
to
to
70
65
60
50
40
s
s
s
s
s
Temperature (°C)
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
•
This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling
recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under
30 watts is recommended.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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