Chip Resistor Arrays - Application Note
Component Placement
a. Reduce the mechanical stress to a minimum during and after placing of the unit in order not to damage the terminals and
protective coating.
b. Misplacement of components may cause solder bridges.
Soldering
a. Reflow soldering: Recommendation is shown in the following chart.
b. Wave soldering: Recommendation according to IEC standards.
c. Hand soldering: Don’t touch the protective coating of the part. Solder within 3 seconds when the temperature is over 280 ºC.
Temperature (¡C)
Preheating
250
200
150
100
50
0
60 sec. min.
Soldering
Gradual Cooling
10-30 sec.
120 sec. min.
Cleaning
A recommended cleaning method is shown in the following table.
Cleaning Condition
Solvents
Dipping
Isopropyl alcohol
5 minutes maximum
Ultrasonic Wave Washing
1 minute maximum
Power: 20 W/L
Frequency: 10 to 100 kHz
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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