BMA253
Data sheet
Page 111
9.3 Landing Pattern Recommendation
For the design of the landing patterns, we recommend the following dimensioning:
Figure 29: Landing patterns; dimensions are in mm
Same tolerances as given for the outline dimensions (Chapter 9.1, Figure 27) should be
assumed.
A wiring no-go area in the top layer of the PCB below the sensor is strongly recommended (e.g.
no vias, wires or other metal structures).
BST-BMA253-DS000-01 | Revision 1.0 | August 2015
Bosch Sensortec
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Note: Specifications within this document are subject to change without notice.
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