NON-ISOLATED DC/DC CONVERTERS
2.4 Vdc - 5.5 Vdc Input, 0.6 Vdc - 3.63 Vdc /6 A Outputs
January 13, 2011
Surface Mount Information
Bel Power, Inc. , a subsidiary of Bel Fuse, Inc.
Pick and Place
The SLIN-06F2Ax modules use an open frame construction and are designed for a fully automated assembly
process. The modules are fitted with a label designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface mount processing, as well as safety standards, and
is able to withstand reflow temperatures of up to 300oC. The label also carries product information such as part
number and serial number.
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Variables such as nozzle
size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The
minimum recommended inside nozzle diameter for reliable operation is 3mm. The maximum nozzle outer
diameter, which will safely fit within the allowable component spacing, is 7 mm.
Lead Free Soldering
The SLIN-06F2Ax modules are lead-free (Pb-free) and RoHS compliant and fully compatible in a Pb-free
soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This
standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of
the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear
reflow profile using Sn/Ag/Cu solder is shown in the figure below. Soldering outside of the recommended profile
requires testing to verify results and performance.
MSL Rating
The SLIN-06F2Ax modules have a MSL rating of 2.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be broken until time of use. Once the original package is broken,
the floor life of the product at conditions of ≤ 30°C and 60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40° C, < 90% relative humidity.
300
Per J-STD-020 Rev. C
Peak Temp 260°C
250
Cooling
200
Zone
* Min. Time Above 235°C
15 Seconds
150
Heating Zone
1°C/Second
*Time Above 217°C
60 Seconds
100
50
0
Reflow Time (Seconds)
Recommended linear reflow profile using Sn/Ag/Cu solder.
Bel Fuse Inc. 206 Van Vorst Street, Jersey City, NJ 07302 • Tel 201-432-0463 • Fax 201-432-9542 • www.belfuse.com
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BEL [ BEL FUSE INC. ]
